| 公告主旨 |
Taiwan Intel : JR0149511 Electronic Package Engineering Graduate Internship （Open） |
| 公告內容 |
➤Job Description
The Intel Optane Group （IOG） Taiwan is looking for a paid intern to help support packaging research and development projects. This position will involve working with assembly subcon team, Intel packaging team, planning, SMT, and electrical test groups.
➤Qualifications
Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
☑The candidate must be pursuing a Master or PhD degree in Materials Science, Chemical Engineering, Mechanical Engineering, Metallurgical Engineering, or related field.
☑The candidate must have the unrestricted right to work in the Taiwan without requiring sponsorship.
Working location : Taiwan Hsinchu
career websites www.intel.com/jobs （JR0149511）
|
